Xilinx Execs to Join Global Electronics Industry Leaders at SEMICON Japan in Opening Keynote Session, U.S. Supply Chain Forum
Xilinx SVP Tong & Xilinx Japan President Rogan to examine economic, technological, market forces behind adoption of All Programmable FPGAs, SoCs, 3D ICs for next-generation electronic system design
Dec 2, 2012
SAN JOSE, Calif., Dec. 2, 2012 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced its participation at SEMICON Japan 2012 being held this week from December 5 - 7, 2012 at Makuhari Messe, International Exhibition Halls & International Conference Hall in Tokyo.
Japan's largest microelectronics manufacturing event will kick off with an Opening Keynote Session on the morning of Wednesday, December 5, where top executives will describe key markets, applications and technological innovations expected to drive global semiconductor industry growth in 2013 and beyond. On the afternoon of the same day, leading executives will convene at a U.S. Supply Chain Forum, moderated by Rika Saito of the U.S. Embassy, to discuss growth strategies for semiconductor supply chain companies in the face of challenging global macroeconomic conditions.
SEMICON Japan 2012
Makuhari Messe, International Exhibition Halls & International Conference Hall
December 5-7, 2012
Xilinx senior vice president of worldwide new product introductions and quality, Vincent Tong, will join an esteemed line-up of executives from Toshiba, Intel and TSMC during the SEMICON Japan opening keynote session. Tong will deliver a talk entitled, "All Programmable 3D IC Integration: Leaping Ahead of Moore's Law."
Xilinx Japan president and representative director, Sam Rogan, will join semiconductor company executives from Altera Japan, Freescale Semiconductor Japan, Ltd., Intel KK and NVIDIA Japan at the U.S. Supply Chain Forum. Rogan's keynote will focus on, "Delivering All Programmable Electronic Systems – a Generation Ahead."
Wednesday, December 5
9:40 a.m. – 12:05 p.m., Int'l Conference Room, 2F
All Programmable 3D IC Integration: Leaping Ahead of Moore's Law
Tong will describe market drivers behind today's demand for radical improvements in system-level IC integration; economic and technology forces that have aligned to enable 3D IC 'stacking' technology to meet stringent market requirements; pioneering advancements resulting in delivery of the world's first All Programmable monolithic and heterogeneous 3D FPGAs; and examples of key applications already benefiting from today's 3D heterogeneous FPGAs. Tong's talk will conclude with an overview of key 3D challenges ahead and a standards call-to-action for our industry.
1:30 p.m. – 3:35 p.m., Int'l Conference Room, 2F
Delivering All Programmable Electronic Systems – a Generation Ahead
Rogan will describe the company's strategy for delivering an extra generation of system performance, low power and programmable system integration to enable today's leading electronics companies to get to market 'a generation ahead' of their competition with All Programmable electronic systems. Xilinx employs all forms of programmable technologies, well beyond programmable hardware to software, beyond digital to analog mixed signal, and beyond single die to multi-die 3D IC implementations. Rogan will provide a first-hand look at how this new generation of devices is inspiring engineers to invent ever smarter, more integrated, bandwidth-hungry systems with fewer chips – faster.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
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